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- Automotive Semiconductor HW R&D & CAE Analysis|Automotive Semiconductor HW Research & CAE Analysis
JOB ID 27362
Automotive Semiconductor HW R&D & CAE Analysis|Automotive Semiconductor HW Research & CAE Analysis
- Manufacturer, Electrical & Electronic
- Semiconductor, Research & Development, QC・QA
- Tokyo
- ¥6,000,000~¥12,500,000
In the automotive parts industry, it is one of the largest companies in Japan in the thermal systems, mobility systems, power train systems, electrification systems, and electronic systems businesses.
We are currently focusing on four areas [electrification, connected systems, advanced safety/automated driving, and non-vehicle businesses (FA/agriculture)].
While identifying issues and considering countermeasures for the automotive application of chiplet technology, which is a cutting-edge technology for consumer products, we will construct a structure to ensure high reliability and high communication quality of 2.5D packages.
Job Description
-
- Responsibilities
- ■CAE analysis and evaluation
of semiconductor packages Actual verification and simulation of Signal Integrity and Power Integrity in high-speed communication inside and outside semiconductor packages.
Improvement of simulation accuracy through mutual comparison, etc.
*Both will be
research and development for the future, such as database creation and theory rule construction. ■Rough design of semiconductor packages and simulation work such as heat, stress, fatigue, and life prediction in automotive applications. Comparative verification with actual aircraft and construction of new technologies.
-
- Requirements
- -Those who have at least 3 years
of experience in verifying and analyzing Signal Integrity and Power Integrity for wired high-speed communication, have experience in designing organic substrates, and have experience in applying simulation results.
- Those who have experience in CAE analysis using either Ansys or Keysight tools.
or
- at least 5 years of experience
in structural analysis of products and structures - experience in structural analysis using any of the tools of Dassault, Ansys
-
- Preferred
- - Experience in evaluating tools, maintaining, and interacting with EDA vendors.
・ Those who have experience in considering the automation of various design and analysis tasks.
・Those who are familiar with scripting using Python, C, tcl, etc.
-
- Location
- Tokyo
-
- Work Style
- Remote working possible, Flex working possible
-
- Salary
- ¥6,000,000~¥12,500,000
-
- Attractive
Points - Japanese company with global opportunities, Listed company, Over 50% Mid-Career Hires, Childcare support system, Weekends and holidays off, Major corporation
- Attractive
Consultation
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- Automotive Semiconductor HW R&D & CAE Analysis|Automotive Semiconductor HW Research & CAE Analysis