JOB ID 27788

Tool Install Engineer

  • Manufacturer, Semiconductor
  • Semiconductor, Production Engineer, Production Engineer
  • Hiroshima
  • ¥5,000,000~¥7,500,000

This company is a global leader in semiconductor memory, specializing in the research, development, manufacturing, and sale of advanced memory technologies used in a wide range of products such as smartphones, data centers, automotive systems, and industrial applications. With a strong focus on innovation and engineering excellence, the organization plays a critical role in enabling technologies like artificial intelligence, cloud computing, and the Internet of Things. It operates within a highly collaborative and international environment, combining cutting-edge technical expertise with a strong emphasis on operational efficiency and talent development. The company is also known for fostering a performance-driven culture while maintaining a supportive workplace that values continuous learning, diversity, and employee growth.

As a Tool Install Engineer, you will lead the installation, expansion, relocation, modification, and decommissioning of semiconductor manufacturing equipment within Micron's production facilities. Working closely with equipment owners, process engineers, facilities teams, contractors, and vendors, you will manage project scope, budget, schedule, safety, and quality to ensure successful tool deployment and startup. You will oversee hookup and construction activities, conduct design reviews and risk assessments, support equipment qualification, and drive continuous improvement initiatives through data analysis and digital technologies to enhance operational efficiency, safety, and cost performance.

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Job Description

  • Responsibilities
    - Lead the installation, expansion, relocation, modification, and decommissioning of semiconductor manufacturing equipment within Micron's fabrication facilities.
    - Plan and manage tool installation projects, ensuring successful execution from project initiation through equipment startup and qualification.
    - Manage project scope, budget, schedule, resources, and deliverables to meet business and operational objectives.
    - Coordinate with Tool Owners, Process Engineers, Facilities Engineers, contractors, and equipment vendors throughout the project lifecycle.
    - Review Tool Service Requirements (TSRs), engineering specifications, and design documentation to ensure installation readiness.
    - Evaluate hookup drawing packages, construction plans, and utility requirements to support equipment installation activities.
    - Assess facility utility capacity and develop infrastructure modification plans to support new and existing manufacturing equipment.
    - Oversee hookup construction, equipment move-in activities, and facility modification work while ensuring compliance with safety and quality standards.
    - Conduct design reviews, risk assessments, and project evaluations to identify and mitigate technical and operational risks.
  • Requirements
    - Business-level Japanese language proficiency
    - Bachelor's degree in Engineering or a related technical field, or equivalent industry experience
    - Experience with equipment installation, construction, facilities, or manufacturing operations in a semiconductor fab or industrial manufacturing environment
    - Project management experience with responsibility for scope, budget, schedule, and execution
    - Knowledge of safety management, construction safety practices, and risk assessment methodologies
  • Preferred
    - Experience in semiconductor manufacturing, process engineering, equipment engineering, or a related technical environment is a plus.
  • Location
    Hiroshima
  • Work Style
    Remote working possible, Flex working possible
  • Salary
    ¥5,000,000~¥7,500,000
  • Attractive
    Points
    Listed company, Foreign capital company, Overseas communication, Weekends and holidays off, Make use of languages

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