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JOB ID 26202

Project Leader - Circuit/PCB Design for Vehicle Safety & Dynamics Sensing Systems

  • Manufacturer, Semiconductor
  • Semiconductor, Research & Development, Research & Development, Circuit & Mounting Design, Electrical & electronic control design, Program・Project Management
  • Tokyo, Hyogo, Aichi
  • ¥6,500,000~¥14,300,000

The company boasts the No. 1 market share in Japan in the automotive components industry in the areas of thermal systems, mobility systems, powertrain systems, electrification systems, and electronic systems.
We are currently focusing on four areas [electrification, connected systems, advanced safety/automated driving, and non-vehicle businesses (FA/agriculture)].

As a project leader of the next generation hardware, you will be involved in the future conception of systems for sensing vehicle behavior necessary for future automated driving and collision safety systems that will be the last resort for automobile accidents.

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Job Description

  • Responsibilities
    Circuit design of airbag ECU
    ・Requirements for ECU to IC manufacturer for RFI/RFQ and technical discussion
    ・Design of electronic circuits consisting of general-purpose components such as power circuits other than ICs
    ・Simulation such as SPICE and MBD (Model Based Development) are used for prospecting
    ■Printed board design of airbag ECU Printed circuit board design of airbag ECUs
    ・Discussions from ECU requirements to external artwork manufacturers and pattern wiring based on manufacturability and EMC performance.
  • Requirements
    Electronic circuit design, semiconductor design
    - Printed circuit board wiring experience
  • Preferred
    -Experience in vehicle projects
    -Experience in crash safety systems
    -Experience in designing inertial sensors (accelerometers, gyro-sensors)
    -Knowledge of development process (A-SPICE etc.), functional safety, cyber security
    -Knowledge of Matlab, HILS, MBD
    -English proficiency (TOEIC score 525 or higher approx. Reading comprehension when component specifications or customer specifications are in English)
  • Location
    Tokyo, Hyogo, Aichi
  • Work Style
    Remote working possible, Flex working possible
  • Salary
    ¥6,500,000~¥14,300,000
  • Attractive
    Points
    Secondary JOB possible, Japanese company with global opportunities, Listed company, Childcare support system, Overseas communication, Make use of languages, Weekends and holidays off, Major corporation

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