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JOB ID 27009

Next-generation planning and development of cutting-edge large-scale SoC-PF (hardware software) leading the SDV era

  • Manufacturer, Electrical & Electronic
  • Electronics, Research ＆ Development, Program・Project Management
  • Tokyo
  • ¥9,000,000～¥14,000,000

In the automotive parts industry, it is one of the largest companies in Japan in the thermal systems, mobility systems, power train systems, electrification systems, and electronic systems businesses.
We are currently focusing on four areas [electrification, connected systems, advanced safety/automated driving, and non-vehicle businesses (FA/agriculture)].

In the field of automobiles, where digitalization is accelerating, we are developing next-generation in-vehicle communication systems, high-performance microcontrollers, SoCs, and electronic components.

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Job Description

  • Responsibilities
    Specifically, you will be involved in one of the following tasks.

    ◆Development of advanced communication technology for in-vehicle communication systems

    ・Development of technologies that are ahead of the latest trends in in-vehicle communications, such as multi-gig communication technology

    ・Construction of virtual development environment for in-vehicle networks

    ・Planning and promotion of communication hardware and software components to be installed in next-generation vehicles

    ・Efficiency of design work using circuit design simulation

    ◆In-house standardization activities for SoC peripheral components (memory, PMIC, communication IC)

    ・Survey of the latest semiconductor technologies and components and vendor analysis

    ・Planning, vendor selection, and component selection that will lead to improving the competitiveness of next-generation ECUs

    ・ECU design support and in-house certification of components

    ◆Development of large-scale semiconductor SoCs

    ・Definition of requirements for the entire SoC and definition of HW architecture

    - Defining and evaluating requirements for IP embedded in SoC

    - General custom HW IP development and firmware development

    ・Advanced development related to chiplet technology
  • Requirements
    Those

    who have basic knowledge of semiconductor engineering (university graduate level) and have at least 3 years of experience in any of the following tasks, work experience

    related to SoC design/development, general knowledge of memory and power supply ICs (PMICs

    ), product design related to data communication, or elemental technology development

    ・Experience in hardware design/development of

    electronic equipment products ・Experience in software design/development of electronic equipment products

  • Preferred
    ・Experience
    as a project leader, product development experience

    at a semiconductor vendor, experience in IC design

    , basic knowledge

    of specifications specific to automotive ICs (e.g., functional safety), experience in evaluating communication equipment (Spana, Oshiro)


    ・Experience in planning, development, design, elemental technology (test technology, package technology, etc.),

    operating system, or lower software development of microcontrollers, microprocessors, or peripheral components.
  • Location
    Tokyo
  • Work Style
    Remote working possible, Flex working possible
  • Salary
    ¥9,000,000～¥14,000,000
  • Attractive
    Points
    Secondary JOB possible, Japanese company with global opportunities, Listed company, Average age 30s, Over 50% Mid-Career Hires, Childcare support system, Overseas business trip, Overseas communication, Weekends and holidays off, Global Mobility, Major corporation, Management Position

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