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- Field Application Engineer
JOB ID 27563
Field Application Engineer
- Manufacturer, Semiconductor
- Semiconductor, FAE
- Kanagawa
- ¥15,000,000~¥22,000,000
The company is a leading global provider of advanced semiconductor manufacturing solutions. With a focus on delivering cutting-edge process technologies, they support a wide range of industries, including automotive, telecommunications, consumer electronics, and data centers. Known for its extensive manufacturing capabilities, the company operates multiple state-of-the-art fabrication facilities worldwide. Their innovative approach ensures the production of high-performance chips for various applications, driving technological advancements and enabling the next generation of smart devices. Committed to sustainability, the company integrates environmental responsibility into its operations, aiming to reduce energy consumption and minimize its environmental footprint. With a strong emphasis on customer collaboration, they provide tailored solutions to meet the specific needs of clients across diverse sectors.
As a Field Application Engineer, you will serve as the primary technical interface for customers, driving pre-sales engagement and enabling design wins by aligning customer requirements with advanced processor IP, software tools, and custom silicon solutions. You will lead technical evaluations by delivering tailored presentations, demonstrations, and hands-on guidance to support customers in adopting MIPS-based solutions, while clearly articulating system-level tradeoffs in performance, power, and cost. Acting as a trusted advisor, you will troubleshoot complex hardware and software challenges during early design phases, ensuring smooth progression from evaluation to implementation. In close collaboration with business development and engineering teams, you will translate customer needs into actionable product insights, influence solution strategy, and help position offerings within the broader semiconductor ecosystem. Additionally, you will contribute to market engagement through workshops, customer training, and partner collaboration, ensuring successful customer outcomes and sustained design win momentum.
Job Description
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- Responsibilities
- - Serve as the primary technical interface for customers during pre-sales and early design engagement phases.
- Support customer evaluations and adoption of processor IP, software tools, and custom silicon solutions.
- Provide hands-on technical guidance on SoC architecture, processor integration, and development toolchains.
- Drive technical discussions to secure design wins and advance opportunities through closure.
- Troubleshoot and resolve customer hardware and software issues during evaluation and initial development.
- Collaborate with internal engineering teams to address complex technical challenges and product gaps.
- Translate customer requirements into actionable insights for product development and solution strategy.
- Deliver technical presentations, demonstrations, and workshops to support customer engagement.
- Partner with business development teams to support proposals, RFIs, and customer solution positioning.
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- Requirements
- - Bachelor’s degree in Electrical Engineering (BSEE) required; Master’s degree (MSEE) preferred.
-7+ years of experience in SoC/ASIC design, architecture, or related semiconductor development.
- Strong understanding of RISC and/or DSP processor architectures and system-level design concepts.
- Awareness of automotive functional safety standards and secure SoC design principles is preferred.
- Strong communication and presentation skills with the ability to engage customers in technical discussions.
- Experience supporting customers in a pre-sales or customer-facing technical role is highly desirable.
- Willingness to travel up to 30% within Japan.
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- Preferred
- - Experience with multiple stages of SoC development, including architecture definition, RTL design (Verilog), synthesis, and physical implementation (preferred).
- Hands-on experience in embedded systems, hardware/software integration, debugging, or firmware/software development.
- Familiarity with software toolchains, compilers, and development environments for processor-based systems.
- Understanding of DSP algorithms and applications (e.g., wireless, LiDAR/RADAR, image processing, sensors) is a plus.
- Knowledge of AI/ML system design considerations and workload requirements is advantageous.
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- Location
- Kanagawa
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- Work Style
- Remote working possible, Flex working possible
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- Salary
- ¥15,000,000~¥22,000,000
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- Attractive
Points - Stock options available, Overseas business trip, Foreign capital company, Make use of languages, Global Mobility
- Attractive
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