JOB ID 27528

Process Engineer

  • Manufacturer, Semiconductor
  • Semiconductor, Research & Development, Production Engineer, Production Management, QC・QA
  • Kanagawa, Hiroshima, Aichi
  • ¥5,500,000~¥15,000,000

A leading global semiconductor equipment manufacturer headquartered in the United States, the company specializes in advanced wafer fabrication technologies and holds a top market share in key process segments such as etching. It supports major semiconductor manufacturers worldwide through a strong network of global operations across Asia, Europe, and North America. Known for its cutting-edge innovation and collaborative, multicultural work environment, the company delivers high-performance solutions while fostering continuous learning, technical excellence, and cross-border teamwork.

As a Process Engineer, you will be responsible for developing and optimizing advanced cryogenic etch processes for ultra‑high aspect ratio features in next‑generation 3D NAND devices. You will evaluate new etch chambers, hardware configurations, and gas chemistries to improve critical performance metrics such as profile control, CD uniformity, selectivity, and defect reduction. In this role, you will remotely operate Fremont-based demo tools from Japan, analyzing experimental data and driving rapid process iteration. You will also collaborate closely with global process and hardware engineering teams to deepen understanding of plasma behavior, etch mechanisms, and hardware design, while supporting customer development activities and delivering technical insights and presentations that enable innovative semiconductor manufacturing solutions.

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Job Description

  • Responsibilities
    - Develop and optimize cryogenic etch processes for ultra‑high aspect ratio structures in advanced 3D NAND devices.
    - Evaluate new etch hardware, chamber configurations, and gas chemistries to improve profile control, CD uniformity, selectivity, and defect performance.
    - Remotely operate and analyze data from demo tools to drive rapid process iteration and continuous improvement.
    - Collaborate with global process and hardware engineering teams to investigate plasma behavior, etch mechanisms, and design enhancements.
    - Support customer process development by delivering technical analyses, presentations, and solutions aligned with next‑generation device requirements.
  • Requirements
    - Master’s degree in Materials Science, Chemical Engineering, Chemistry, Physics, or a related field with 3+ years of experience; or a PhD with no prior professional experience (or equivalent experience).
    - Hands-on experience working in laboratory environments and on semiconductor equipment, including surface preparation and analytical techniques.
    - Strong understanding of Statistical Process Control (SPC) and/or Design of Experiments (DOE).
    - Proficiency in scientific programming tools such as MATLAB, Python, or similar languages.
    - Solid knowledge of statistical analysis and problem-solving methodologies, with experience using tools like JMP or Minitab.
    - Background in thin film or deposition technologies such as ALD, CVD, PECVD, or PVD.
    - Knowledge of material synthesis and characterization techniques.
    - Experience interacting with semiconductor customers and supporting process or technology development activities.
    - Ability to speak N2 level Japanese
  • Preferred
    - Ability to communicate in Basic or Conversational English
  • Location
    Kanagawa, Hiroshima, Aichi
  • Salary
    ¥5,500,000~¥15,000,000
  • Attractive
    Points
    Stock options available, Average age 30s, New graduates welcome, Foreign capital company, Weekends and holidays off, Make use of languages, Major corporation

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