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- Next-Generation Semiconductor Packaging Materials Development | Materials Development for Next-Generation Semiconductor Packaging
JOB ID 27868
Next-Generation Semiconductor Packaging Materials Development | Materials Development for Next-Generation Semiconductor Packaging
- Manufacturer, Automotive Parts
- Semiconductor, Research ＆ Development, Research ＆ Development
- Osaka
- ¥5,500,000～¥9,500,000
As a major Japanese manufacturer with a global presence, we operate B2B businesses mainly in electronic components and materials. It is characterized by its deep involvement in growth areas such as automotive, telecommunications infrastructure, and semiconductors, supporting product development for manufacturers worldwide.
Leveraging production and development bases both domestically and internationally, we have built a consistent global supply system, and our business model focuses on the "contents" rather than finished products, creating long-term and stable business relationships. With scale and reliability as a member of a major group, we are expected to continue growing in overseas markets.
In addition to developing new material technologies applicable to future wiring boards, you will work together with customers to pioneer new markets.
Job Description
-
- Responsibilities
- ・Elemental technology development for new substrate materials for semiconductor PKGs (principle verification, material design)
・Development of evaluation technologies related to the above (including internal and external collaboration)
・Collaborative activities with raw material suppliers (requests for new material synthesis and improvements, etc.)
・Domestic and international customer support (needs surveys, prototype sample provision), technology marketing activities, patent applications
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- Requirements
- ・At least
one year of experience in material development and design using curable resins ・Knowledge of organic chemistry related to chemical reactions
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- Preferred
- ・Knowledge of low-dielectric materials and experience in developing electronic materials
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- Location
- Osaka
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- Work Style
- Remote working possible, Flex working possible
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- Salary
- ¥5,500,000～¥9,500,000
-
- Attractive
Points - Japanese company with global opportunities, Listed company, Childcare support system, Weekends and holidays off, Major corporation, New businesses and services
- Attractive
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- Next-Generation Semiconductor Packaging Materials Development | Materials Development for Next-Generation Semiconductor Packaging