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JOB ID 25767

Semiconductor Packaging & Test Engineer (Automotive)｜Semiconductor Packaging & Test Process Engineer (Automotive)

  • Manufacturer, Semiconductor, Electrical & Electronic, Automotive Parts
  • Semiconductor, Production Engineer, Production Engineer
  • Aichi, Japan
  • ¥6,500,000～¥14,300,000

The company boasts the No. 1 market share in Japan in the automotive components industry in the areas of thermal systems, mobility systems, powertrain systems, electrification systems, and electronic systems.
We are currently focusing on four areas [electrification, connected systems, advanced safety/automated driving, and non-vehicle businesses (FA/agriculture)].

You will be responsible for developing innovative production technologies in automotive semiconductors (ASICs), and building and launching production lines incorporating groundbreaking production systems.

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Job Description

  • Responsibilities
    Development of innovative production technology" and "Establishment and start-up of production line incorporating innovative production system" in automotive semiconductor (ASIC)
    ・Development of production technology for automotive semiconductor (ASIC) (bonding, molding, image/electric characteristic inspection/visual inspection, etc.)
    ・Launch of production line (process design and production preparation)
    ・Improvement activities of parts and materials Improvement activities with suppliers

  • Requirements
    Experience in production engineering work (mainly production line process design and production technology development).
    *Career advancement through product and line start-up work.
    * Knowledge and experience in semiconductor back-end processes and desire to further develop this knowledge and experience.



  • Preferred
    Work experience (more than 3 years) in production engineering and any of the following:
    ・Production line start-up (process design, equipment planning, introduction), product/production technology development ・Production system development/introduction
    ・Semiconductor back-end process (package) development ・Electric/Electronic/Semiconductor component design, surface treatment (laser)
    ・Data processing using big data Data processing using big data ・Image and data judgment using machine learning
    ・Statistical quality control methods (SQC) ・Joining (solder, ultrasonic, die bond, wire bond, etc.)
    ・Molding (thermosetting resin) ・Inspection technology (image, electrical inspection) ・Overseas production technology work
  • Location
    Aichi, Japan
  • Work Style
    Flex working possible
  • Salary
    ¥6,500,000～¥14,300,000
  • Attractive
    Points
    Japanese company with global opportunities, Listed company, Childcare support system, Weekends and holidays off, Major Major corporation

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  • Manufacturer, Semiconductor, Electrical & Electronic, Automotive Parts
  • Semiconductor, Production Engineer, Production Engineer
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The company boasts the No. 1 market share in Japan in the automotive components industry in the areas of thermal systems, mobility systems, powertrain systems, electrification systems, and electronic systems.
Currently, the company is focusing on four areas: electrification, connectivity, advanced safety/automated driving, and non-automotive business (FA/agriculture).

We are one of the world's top-class automotive parts manufacturers. We are involved in the production of electrical components, thermal products, and automatic driving related systems, etc., for a single vehicle.
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We have a number of production engineering positions available, so please apply according to your experience and expectations.
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