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JOB ID 27419

Automotive semiconductor hardware research and CAE analysis

  • Manufacturer, Electrical & Electronic
  • Semiconductor, Research ＆ Development, Product Engineer (Hard/soft)
  • Tokyo
  • ¥5,500,000～¥14,300,000

We are a company boasting one of the top domestic market shares in the automotive parts industry, specializing in thermal systems, mobility systems, power train systems, electrification systems, and electronic systems.
Currently, we are focusing on four areas: electrification, connectivity, advanced safety/autonomous driving, and non-vehicle businesses (FA/agriculture). In particular, in the field of autonomous driving, we are conducting demonstration experiments on public roads for Level 4 autonomous driving, working toward the future of safe and secure mobility systems.

Aiming to strengthen Japan's competitiveness in the automotive sector, we collaborate across multiple companies across industries to conduct semiconductor research.　

Specifically, while identifying issues and considering countermeasures when applying chiplet technology, a cutting-edge consumer technology, in vehicles, we have built structures to ensure high reliability and communication quality in 2.5D packages.

You will be engaged in the following tasks.

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Job Description

  • Responsibilities

    (1) Conduct CAE analysis and evaluation of semiconductor packages.　

    Actual verification and simulation of Signal Integrity and Power Integrity in high-speed communication inside and outside semiconductor packages.　

    Improving simulation accuracy through mutual comparison, etc.

    All of these involve research and development

    for the future, such as database creation and the construction of theory rules. (2) Similarly, rough design of semiconductor packages and simulation tasks for heat, stress, fatigue, and lifespan prediction in automotive applications. Comparative verification with actual machines and development of new technologies.
  • Requirements
    At least 3 years of experience

    verifying and analyzing signal integrity and power integrity in wired high-speed communications. - Experience designing organic substrates and applying simulation results.

    - Experience in CAE analysis using either Ansys or Keysight tools.

    Or

    - Have at least 5 years of experience in structural analysis of manufactured goods or structures.

    - Experience in structural analysis using either Dassault or Ansys tools
  • Preferred
    Experience in tool evaluation, maintenance, and interactions with EDA vendors.

    Experience in automating various design and analysis tasks.

    Candidates proficient in script creation using Python, C, tcl, etc.
  • Location
    Tokyo
  • Work Style
    Remote working possible, Flex working possible
  • Salary
    ¥5,500,000～¥14,300,000
  • Attractive
    Points
    Secondary JOB possible, Japanese company with global opportunities, Listed company, Childcare support system, Weekends and holidays off, Major corporation

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