Automotive SoC Research and Development Management

Next-Generation Power Semiconductor Process Development | Process Development for Next-Generation Power Semiconductor Devices

In the automotive parts industry, it is one of the largest companies in Japan in the thermal systems, mobility systems, power train systems, electrification systems, and electronic systems businesses.
We are currently focusing on four areas [electrification, connected systems, advanced safety/automated driving, and non-vehicle businesses (FA/agriculture)].

You will be involved in planning, designing, and process development for high-voltage, high-current power semiconductor devices (Si-IGBT, SiC-MOSFET, GaN-HEMT) for inverter systems for electric vehicles.

Details.

Digital Implementation Design Manager/Director (Backend / Frontend)

The company is a major player in the development of advanced memory solutions that power everything from artificial intelligence and high-performance computing to smartphones, data centers and next-generation technologies. With the rapid expansion of AI and data-driven computing, its technologies are becoming increasingly critical to the future of the digital world.

This role offers the opportunity to work within a highly international and technology-driven environment, collaborating with global teams on cutting-edge semiconductor technologies. For an experienced engineering leader, it is a chance to take ownership of important technology initiatives while contributing to a business that is playing a key role in shaping the next generation of computing.


This position is responsible for the digital implementation of advanced DRAM products, promoting product performance and competitiveness by utilizing the latest EDA tools and advanced processes below 5nm.

On the frontend, I am involved in all aspects of digital implementation, including synthesis, STA, and DFT, and on the backend, I am involved in automatic wiring placement and PDN implementation. I am also responsible for design analysis and environment improvement using Tcl/Python, as well as IP implementation according to customer requirements.

Details.

Embedded software (software architecture design and middleware design) for camera platforms for automotive image sensors and domain controllers, as well as software project management

In the automotive parts industry, it is one of the largest companies in Japan in the thermal systems, mobility systems, power train systems, electrification systems, and electronic systems businesses.
We are currently focusing on four areas [electrification, connected systems, advanced safety/automated driving, and non-vehicle businesses (FA/agriculture)].

In the world of SDVs, we are seeking partners to work on cutting-edge image sensor development through the development of in-vehicle software platforms for autonomous driving (AD) and safety systems (ADAS).

Let's work together to reduce fatal accidents and provide safe/secure mobility.

Details.

Next-Generation Power Semiconductor Device Engineer | Device Development for Next-Generation Power Semiconductor Devices

In the automotive parts industry, it is one of the largest companies in Japan in the thermal systems, mobility systems, power train systems, electrification systems, and electronic systems businesses.
We are currently focusing on four areas [electrification, connected systems, advanced safety/automated driving, and non-vehicle businesses (FA/agriculture)].

You will be involved in the planning, development, and design of high-voltage, high-current power semiconductor devices (Si-IGBT, SiC-MOSFET, GaN-HEMT) for inverter systems for electric vehicles.

Details.

Product planning and advanced development of integrated control ECUs in the SDV era

In the automotive parts industry, it is one of the largest companies in Japan in the thermal systems, mobility systems, power train systems, electrification systems, and electronic systems businesses.
We are currently focusing on four areas [electrification, connected systems, advanced safety/automated driving, and non-vehicle businesses (FA/agriculture)].

■ In the SDV (Software Defined Vehicle) era, we plan and develop key domain systems such as ADAS/cockpits, which serve as the brain of vehicles, and key components like integrated control ECUs, as well as conduct consultations and proposals with customers, carrying out cross-departmental execution management toward commercialization

Details.

Development of cybersecurity functions for in-vehicle integrated computers (mobility computers) (development of core products that integrate with the cloud as the core for SDV realization)

In the automotive parts industry, it is one of the largest companies in Japan in the thermal systems, mobility systems, power train systems, electrification systems, and electronic systems businesses.
We are currently focusing on four areas [electrification, connected systems, advanced safety/automated driving, and non-vehicle businesses (FA/agriculture)].

We are looking for partners who will jointly develop the security technologies necessary to protect cars and related services from cyberattack threats and incorporate them into our products.

Details.

Semiconductor Relay Product Development | Semiconductor Relay Product Planning and Development

As a major Japanese manufacturer with a global presence, we operate B2B businesses mainly in electronic components and materials. It is characterized by its deep involvement in growth areas such as automotive, telecommunications infrastructure, and semiconductors, supporting product development for manufacturers worldwide.
Leveraging production and development bases both domestically and internationally, we have built a consistent global supply system, and our business model focuses on the "contents" rather than finished products, creating long-term and stable business relationships. With scale and reliability as a member of a major group, we are expected to continue growing in overseas markets.

You will play an active role as the leader of the department responsible for planning, concepting, and developing new semiconductor relay products.
This is a work that contributes to the development of semiconductor devices and strengthening foundational technology for the high-profit, core semiconductor relay business within the division.
It is expected that we will promote the planning and development of semiconductor relay devices and process development by leveraging internal and external technical development collaboration and technical know-how.

Details.

Semiconductor Packaging Materials Development | Development and Design of Materials for Semiconductor Packaging

As a major Japanese manufacturer with a global presence, we operate B2B businesses mainly in electronic components and materials. It is characterized by its deep involvement in growth areas such as automotive, telecommunications infrastructure, and semiconductors, supporting product development for manufacturers worldwide.
Leveraging production and development bases both domestically and internationally, we have built a consistent global supply system, and our business model focuses on the "contents" rather than finished products, creating long-term and stable business relationships. With scale and reliability as a member of a major group, we are expected to continue growing in overseas markets.

This position involves developing materials and process element technologies that enhance the functionality of seat materials.

Details.

Next-Generation Semiconductor Packaging Materials Development | Materials Development for Next-Generation Semiconductor Packaging

As a major Japanese manufacturer with a global presence, we operate B2B businesses mainly in electronic components and materials. It is characterized by its deep involvement in growth areas such as automotive, telecommunications infrastructure, and semiconductors, supporting product development for manufacturers worldwide.
Leveraging production and development bases both domestically and internationally, we have built a consistent global supply system, and our business model focuses on the "contents" rather than finished products, creating long-term and stable business relationships. With scale and reliability as a member of a major group, we are expected to continue growing in overseas markets.

In addition to developing new material technologies applicable to future wiring boards, you will work together with customers to pioneer new markets.

Details.