Ceramic Packaging Development Engineer | Ceramic Packaging Development Process Development

Semiconductor & Electronic Component Specialist

This company is an international automotive technology company specializing in advanced electronic systems and intelligent mobility solutions. The company develops and delivers innovative hardware and software technologies that enhance vehicle safety, performance, and driving assistance capabilities.

Working closely with major automotive manufacturers, the company supports the development of next-generation vehicle technologies, including advanced driver assistance systems (ADAS), automotive sensing solutions, and integrated electronic systems. With access to global engineering expertise and advanced technologies, the company plays an important role in supporting the automotive industry's transition toward safer, smarter, and increasingly software-driven vehicles.

A global automotive technology supplier is seeking a Semiconductor & Electronic Component Specialist to support the development and execution of global semiconductor and electronic component strategies.

The position focuses on component selection, technical evaluation, qualification, supplier development, and lifecycle management to ensure reliable and sustainable product development.

You will collaborate with engineering, quality, manufacturing, and supplier organizations to maintain component quality, regulatory compliance, technology competitiveness, and long-term supply continuity.

This is a technical specialist position combining semiconductor engineering expertise, electronic component management, supplier coordination, and global technology strategy.

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Semiconductor Principal Design Engineer

This company is a global leader in semiconductor memory, specializing in the research, development, manufacturing, and sale of advanced memory technologies used in a wide range of products such as smartphones, data centers, automotive systems, and industrial applications. With a strong focus on innovation and engineering excellence, the organization plays a critical role in enabling technologies like artificial intelligence, cloud computing, and the Internet of Things. It operates within a highly collaborative and international environment, combining cutting-edge technical expertise with a strong emphasis on operational efficiency and talent development. The company is also known for fostering a performance-driven culture while maintaining a supportive workplace that values continuous learning, diversity, and employee growth.

As a Principal Design Engineer within Micron’s NAND Engineering Group (NVEG), you will lead the design and optimization of advanced datapath architectures for next-generation 3D NAND memory products. You will be responsible for developing high-speed, low-power TSV (Through-Silicon Via) interface circuits and highly parallel internal bus architectures that enable improved performance, signal integrity, and power efficiency. Working closely with circuit design, process technology, DTCO, packaging, and product engineering teams, you will drive key architectural decisions and guide projects from concept through silicon validation. In this role, you will perform timing, signal integrity, and power integrity analysis while ensuring robust design-for-testability and redundancy implementation across complex memory subsystems. You will also support silicon bring-up, debug, and yield improvement activities, identifying opportunities to enhance product quality and manufacturability. Through technical leadership and cross-functional collaboration, you will help shape future NAND memory technologies that support AI, cloud, and high-performance computing applications.

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Electrochemical Process Development Engineer | Process research and development of electrochemical products for next-generation energy

In the automotive parts industry, we are a company boasting one of the top domestic market shares in thermal systems, mobility systems, power train systems, electrification systems, and electronic systems.
Currently, we are focusing on four areas: electrification, connectivity, advanced safety/autonomous driving, and non-vehicle business (FA/agriculture)]. In particular, in the field of autonomous driving, we are conducting demonstration experiments on public roads for Level 4 autonomous driving, working toward the future of safe and secure mobility systems.

To achieve carbon neutrality, you will be engaged in process development for electrochemical cell products used in environmentally related products, which are the main focus of business expansion.

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Next-Generation Power Semiconductor Process Development | Process Development for Next-Generation Power Semiconductor Devices

In the automotive parts industry, it is one of the largest companies in Japan in the thermal systems, mobility systems, power train systems, electrification systems, and electronic systems businesses.
We are currently focusing on four areas [electrification, connected systems, advanced safety/automated driving, and non-vehicle businesses (FA/agriculture)].

You will be involved in planning, designing, and process development for high-voltage, high-current power semiconductor devices (Si-IGBT, SiC-MOSFET, GaN-HEMT) for inverter systems for electric vehicles.

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Digital Implementation Design Manager/Director (Backend / Frontend)

The company is a major player in the development of advanced memory solutions that power everything from artificial intelligence and high-performance computing to smartphones, data centers and next-generation technologies. With the rapid expansion of AI and data-driven computing, its technologies are becoming increasingly critical to the future of the digital world.

This role offers the opportunity to work within a highly international and technology-driven environment, collaborating with global teams on cutting-edge semiconductor technologies. For an experienced engineering leader, it is a chance to take ownership of important technology initiatives while contributing to a business that is playing a key role in shaping the next generation of computing.


This position is responsible for the digital implementation of advanced DRAM products, promoting product performance and competitiveness by utilizing the latest EDA tools and advanced processes below 5nm.

On the frontend, I am involved in all aspects of digital implementation, including synthesis, STA, and DFT, and on the backend, I am involved in automatic wiring placement and PDN implementation. I am also responsible for design analysis and environment improvement using Tcl/Python, as well as IP implementation according to customer requirements.

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Embedded software (software architecture design and middleware design) for camera platforms for automotive image sensors and domain controllers, as well as software project management

In the automotive parts industry, it is one of the largest companies in Japan in the thermal systems, mobility systems, power train systems, electrification systems, and electronic systems businesses.
We are currently focusing on four areas [electrification, connected systems, advanced safety/automated driving, and non-vehicle businesses (FA/agriculture)].

In the world of SDVs, we are seeking partners to work on cutting-edge image sensor development through the development of in-vehicle software platforms for autonomous driving (AD) and safety systems (ADAS).

Let's work together to reduce fatal accidents and provide safe/secure mobility.

Details.

Next-Generation Power Semiconductor Device Engineer | Device Development for Next-Generation Power Semiconductor Devices

In the automotive parts industry, it is one of the largest companies in Japan in the thermal systems, mobility systems, power train systems, electrification systems, and electronic systems businesses.
We are currently focusing on four areas [electrification, connected systems, advanced safety/automated driving, and non-vehicle businesses (FA/agriculture)].

You will be involved in the planning, development, and design of high-voltage, high-current power semiconductor devices (Si-IGBT, SiC-MOSFET, GaN-HEMT) for inverter systems for electric vehicles.

Details.

Product planning and advanced development of integrated control ECUs in the SDV era

In the automotive parts industry, it is one of the largest companies in Japan in the thermal systems, mobility systems, power train systems, electrification systems, and electronic systems businesses.
We are currently focusing on four areas [electrification, connected systems, advanced safety/automated driving, and non-vehicle businesses (FA/agriculture)].

■ In the SDV (Software Defined Vehicle) era, we plan and develop key domain systems such as ADAS/cockpits, which serve as the brain of vehicles, and key components like integrated control ECUs, as well as conduct consultations and proposals with customers, carrying out cross-departmental execution management toward commercialization

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Development of cybersecurity functions for in-vehicle integrated computers (mobility computers) (development of core products that integrate with the cloud as the core for SDV realization)

In the automotive parts industry, it is one of the largest companies in Japan in the thermal systems, mobility systems, power train systems, electrification systems, and electronic systems businesses.
We are currently focusing on four areas [electrification, connected systems, advanced safety/automated driving, and non-vehicle businesses (FA/agriculture)].

We are looking for partners who will jointly develop the security technologies necessary to protect cars and related services from cyberattack threats and incorporate them into our products.

Details.