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  • Semiconductor Packaging Materials Development | Development and Design of Materials for Semiconductor Packaging

JOB ID 27869

Semiconductor Packaging Materials Development | Development and Design of Materials for Semiconductor Packaging

  • Manufacturer, Automotive Parts
  • Semiconductor, Research & Development, Research & Development
  • Osaka
  • ¥5,000,000~¥7,300,000

As a major Japanese manufacturer with a global presence, we operate B2B businesses mainly in electronic components and materials. It is characterized by its deep involvement in growth areas such as automotive, telecommunications infrastructure, and semiconductors, supporting product development for manufacturers worldwide.
Leveraging production and development bases both domestically and internationally, we have built a consistent global supply system, and our business model focuses on the "contents" rather than finished products, creating long-term and stable business relationships. With scale and reliability as a member of a major group, we are expected to continue growing in overseas markets.

This position involves developing materials and process element technologies that enhance the functionality of seat materials.

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Job Description

  • Responsibilities
    ・Experience in sheet material development (material development, evaluation technology), and knowledge of
    applied technologies for elastic sheet properties ・Material formulation design, key technology development in sheet formation processes (improving properties, sheet formation, coating technology, varnishing, etc.)
    ・Prototype evaluation (physical property evaluation, reliability evaluation, etc.)
    ・Negotiation with raw material suppliers that make up the product (new material synthesis requests, sample requests, etc.)
    ・Patent application
  • Requirements
    ・Experience in material development for the semiconductor market or composite material development for electronic applications
  • Preferred
    ・Experience in sheet material development (material development, process technology, evaluation technology), knowledge of application technologies for
    low-elasticity sheet materials ・Experience
    in developing sheet forming processes ・Knowledge of data analysis, statistics, and simulation analysis
    experience ・Experience communicating in English
  • Location
    Osaka
  • Work Style
    Remote working possible, Flex working possible
  • Salary
    ¥5,000,000~¥7,300,000
  • Attractive
    Points
    Japanese company with global opportunities, Listed company, Childcare support system, Weekends and holidays off, Major corporation, New businesses and services

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