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JOB ID 28313

Automotive PCB Assembly Equipment & Process Improvement Engineer | Equipment and Process Improvement Engineer for Automotive Substrate Mounting Lines

  • Manufacturer, Automotive Parts
  • Mechanical, Production Engineer, Production Engineer
  • Nagano
  • ¥5,000,000~¥9,700,000

As a world-class automotive parts supplier, we globally offer a wide range of products and solutions that support the next-generation mobility society, including in-vehicle infotainment, electronics, electrification, and advanced driver assistance technologies (ADAS). Through cutting-edge technologies that connect people, cars, and society, we contribute to realizing safe, comfortable, and sustainable mobility experiences. Based on strong partnerships with automotive OEMs, we aim to create innovative value that meets ever-changing market needs.

As a technical officer in the implementation process, you will take on the following roles.

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Job Description

  • Responsibilities
    ■Equipment and Quality Issue Resolution
    ・Root cause analysis for issues with mounters, printers, reflow ovens, inspection equipment, and more
    ・Temporary and permanent solutions for assembly defects, equipment downtime, and process variation
    ・Planning, standardization, and on-site implementation of measures to prevent recurrence

    ■Process Condition Optimization and Improvement
    ・Review of solder paste printing, component placement, reflow, and AOI/SPI inspection conditions
    ・Promotion of improvement initiatives using yield, defect rate, and equipment downtime data
    ・Improvement of process quality and productivity in collaboration with the manufacturing, quality, and equipment departments

    ■New Product Launch and Process Design Support
    ・Setting and evaluating process conditions, and identifying quality risks during new product launches
    ・Developing manufacturing standards, procedures, and inspection checklists
  • Requirements
    ・Experience
    in equipment maintenance, production technology, manufacturing technology, or process improvement in manufacturing ・Basic knowledge
    of electronic devices, electronic components, and circuit board mounting ・Experience
    in troubleshooting, cause analysis, and improvement activities at manufacturing sites ・Experience organizing and analyzing
    data using Excel and similar tools ・Experience collaborating with related departments to promote improvements
  • Preferred
    ・Experience
    in SMT mounting lines, solder printing, component mounting, and reflow processes ・Knowledge and experience
    with mounters, printing machines, reflow furnaces, AOI/SPI/X-ray inspection equipment ・Experience
    in mounting defect analysis, solder joining, process condition setting, and yield improvement ・Experience in the seven QC tools, why-why analysis, FMEA, process capabilities, and utilization
    of control charts ・Experience in manufacturing, quality, and equipment of automotive products or automotive parts
  • Location
    Nagano
  • Work Style
    Remote working possible, Flex working possible
  • Salary
    ¥5,000,000~¥9,700,000
  • Attractive
    Points
    Japanese company with global opportunities, Listed company, Average age 30s, Over 50% Mid-Career Hires, Childcare support system, Overseas business trip, Weekends and holidays off, Major corporation, New businesses and services, Management Position

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